
The superior non-contacting measurement solution for profilometry, resulting in superior fidelity and dependable results, suitable for a wide range of applications including soft or sensitive surfaces. The uncompromising construction unites unequalled resolution, precision and measurement speed within a single appliance. Robust, free of maintenance, long-lived. Determination of flatness, altitude or position. Calculation of properties like roughness, area or volume. Vibration analysis.
Robust, free of maintenance, long-lived.
Determination of flatness, altitude or position.
Calculation of properties like roughness, area or volume.
Vibration analysis.
Thick film and hybrids Optics, telecommunication, electrical engineering,electronics industry material testing, tribology Mechanical engineering (form, flatness, waviness,roughness) IC packaging (warpage, coplanarity, bump height and volume)

Model | NLS13 |
Measurement range, mm | 1.5 |
Resolution,nm | 10 |
Linearity | ≤ 0.2um |
Repeatability,nm | ≤ 10 |
Stand-off,mm | 2.0 |
Laser sourceW | 780 nm semiconductor laser diode |
Measurement spot diameter,µm | 1.9um |
Maximum surface tilt º | 90±25 |
Sampling frequency,Hz | 16~10K |
Data transmission | RS232 |
Weight,g | Sensor approx. 5000,Controller approx. 4000 |
◆We reserve the right to change the specifications without notice.
Thick film and hybrids Optics, telecommunication, electrical engineering,electronics industry material testing, tribology Mechanical engineering (form, flatness, waviness,roughness) IC packaging (warpage, coplanarity, bump height and volume)

Thick film and hybrids Optics, telecommunication, electrical engineering,electronics industry material testing, tribology Mechanical engineering (form, flatness, waviness,roughness) IC packaging (warpage, coplanarity, bump height and volume)

Thick film and hybrids Optics, telecommunication, electrical engineering,electronics industry material testing, tribology Mechanical engineering (form, flatness, waviness,roughness) IC packaging (warpage, coplanarity, bump height and volume)



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