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NLS13 Nano-displacement Sensor

The superior non-contacting measurement solution for profilometry, resulting in superior fidelity and dependable results, suitable for a wide range of applications including soft or sensitive surfaces. The uncompromising construction unites unequalled resolution, precision and measurement speed within a single appliance. Robust, free of maintenance, long-lived. Determination of flatness, altitude or position. Calculation of properties like roughness, area or volume. Vibration analysis.

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-Main features-
  • Robust, free of maintenance, long-lived.

  • Determination of flatness, altitude or position.

  • Calculation of properties like roughness, area or volume.

  • Vibration analysis.

-Application area-

Thick film and hybrids Optics, telecommunication, electrical engineering,electronics industry material testing, tribology Mechanical engineering (form, flatness, waviness,roughness) IC packaging (warpage, coplanarity, bump height and volume)

   


-Technical specifications-

Model

NLS13

Measurement range, mm

1.5

Resolution,nm

10

Linearity

   ≤ 0.2um

Repeatability,nm

≤ 10

Stand-off,mm

2.0

Laser sourceW

780 nm semiconductor laser diode

Measurement spot diameter,µm

1.9um

Maximum surface tilt º

90±25

Sampling frequency,Hz

16~10K

Data transmission

RS232

Weight,g

Sensor approx. 5000,Controller approx. 4000

◆We reserve the right to change the specifications without notice.

-Measuring principle-

Thick film and hybrids Optics, telecommunication, electrical engineering,electronics industry material testing, tribology Mechanical engineering (form, flatness, waviness,roughness) IC packaging (warpage, coplanarity, bump height and volume)

   


-Industry solutions-

Thick film and hybrids Optics, telecommunication, electrical engineering,electronics industry material testing, tribology Mechanical engineering (form, flatness, waviness,roughness) IC packaging (warpage, coplanarity, bump height and volume)

   



-Successful case-

Thick film and hybrids Optics, telecommunication, electrical engineering,electronics industry material testing, tribology Mechanical engineering (form, flatness, waviness,roughness) IC packaging (warpage, coplanarity, bump height and volume)

   



-Mounting dimensions-

-Related products-
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